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Press Release
August 18, 2026

Morse Micro Selects Pace Wireless for its Wi-Fi HaLow Design Partner Program

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Press Release
July 31, 2026

Quectel's FGH200M Wi-Fi HaLow Module, Built on Morse Micro's MM8108, Now FCC/IC/CE/RCM Certified for Mass Production

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Press Release
July 8, 2026

Morse Micro Welcomes CA Engineering to Wi-Fi HaLow Design Partner Program

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Press Release
August 20, 2026

Morse Micro announces two Wi-Fi HaLow USB Dongle Reference Designs to enable long-range Edge AI connectivity

Two new USB dongles bringing Wi-Fi HaLow to existing devices via a simple USB connection.

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Press Release
August 18, 2026

Morse Micro Selects Pace Wireless for its Wi-Fi HaLow Design Partner Program

Chicago-based engineering team brings rapid prototyping and design-for-manufacturing discipline to the global Wi-Fi HaLow ecosystem

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Press Release
July 31, 2026

Quectel's FGH200M Wi-Fi HaLow Module, Built on Morse Micro's MM8108, Now FCC/IC/CE/RCM Certified for Mass Production

Quectel's FGH200M Module Now Certified for Mass Production

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Press Release
July 8, 2026

Morse Micro Welcomes CA Engineering to Wi-Fi HaLow Design Partner Program

The partnership strengthens Morse Micro's reach across North America, giving customers a clearer path from idea to working system.

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Blog
July 6, 2026

Morse Micro Wins 2026 Pinnacle Award for Advancing Edge AI Connectivity

Morse Micro's MM8108 chip wins Emerald Award in the Edge AI Deployment category at the 2026 Pinnacle Awards.

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Press Release
June 16, 2026

Morse Micro Welcomes VPI Technology to Wi-Fi HaLow Design Partner Program

Expanding the global Wi-Fi HaLow ecosystem with full-stack product design and manufacturing expertise

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